LPC2109 2119 2129

LPC2109/2119/2129
Single-chip 16/32-bit microcontrollers; 64/128/256 kB ISP/IAP
flash with 10-bit ADC and CAN
Rev. 7 — 14 June 2011
Product data sheet
1. General description
The LPC2109/2119/2129 are based on a 16/32-bit ARM7TDMI-S CPU with real-time
emulation and embedded trace support, together with 64/128/256 kB of embedded
high-speed flash memory. A 128-bit wide memory interface and a unique accelerator
architecture enable 32-bit code execution at maximum clock rate. For critical code size
applications, the alternative 16-bit Thumb mode reduces code by more than 30 % with
minimal performance penalty.
With their compact 64-pin package, low power consumption, various 32-bit timers,
4-channel 10-bit ADC, two advanced CAN channels, PWM channels and 46 fast GPIO
lines with up to nine external interrupt pins these microcontrollers are particularly suitable
for automotive and industrial control applications, as well as medical systems and
fault-tolerant maintenance buses. With a wide range of additional serial communications
interfaces, they are also suited for communication gateways and protocol converters as
well as many other general-purpose applications.
Remark: Throughout the data sheet, the term LPC2109/2119/2129 will apply to devices
with and without the /00 or /01 suffixes. The /00 or the /01 suffix will be used to
differentiate from other devices only when necessary.
2. Features and benefits
2.1 Key features brought by LPC2109/2119/2129/01 devices
 Fast GPIO ports enable port pin toggling up to 3.5 times faster than the original device.
They also allow for a port pin to be read at any time regardless of its function.
 Dedicated result registers for ADC(s) reduce interrupt overhead. The ADC pads are
5 V tolerant when configured for digital I/O function(s).
 UART0/1 include fractional baud rate generator, auto-bauding capabilities and
handshake flow-control fully implemented in hardware.
 Buffered SSP serial controller supporting SPI, 4-wire SSI, and Microwire formats.
 SPI programmable data length and master mode enhancement.
 Diversified Code Read Protection (CRP) enables different security levels to be
implemented. This feature is available in LPC2109/2119/2129/00 devices as well.
 General purpose timers can operate as external event counters.
2.2 Key features common for all devices
 16/32-bit ARM7TDMI-S microcontroller in a tiny LQFP64 package.
 8/16 kB on-chip SRAM.
LPC2109/2119/2129
NXP Semiconductors
Single-chip 16/32-bit microcontrollers
 64/128/256 kB on-chip flash program memory. 128-bit wide interface/accelerator
enables high speed 60 MHz operation.
 In-System Programming (ISP) and In-Application Programming (IAP) via on-chip
bootloader software. Flash programming takes 1 ms per 512 B line. Single sector or
full chip erase takes 400 ms.
 EmbeddedICE-RT interface enables breakpoints and watch points. Interrupt service
routines can continue to execute while the foreground task is debugged with the
on-chip RealMonitor software.
 Embedded Trace Macrocell (ETM) enables non-intrusive high speed real-time tracing
of instruction execution.
 Two interconnected CAN interfaces (one for LPC2109) with advanced acceptance
filters.
 Four-channel 10-bit A/D converter with conversion time as low as 2.44 s.
 Multiple serial interfaces including two UARTs (16C550), Fast I2C-bus (400 kbit/s) and
two SPIs.
 60 MHz maximum CPU clock available from programmable on-chip Phase-Locked
Loop with settling time of 100 s.
 Vectored Interrupt Controller with configurable priorities and vector addresses.
 Two 32-bit timers (with four capture and four compare channels), PWM unit (six
outputs), Real-Time Clock (RTC) and watchdog.
 Up to forty-six 5 V tolerant general purpose I/O pins. Up to nine edge or level sensitive
external interrupt pins available.
 On-chip crystal oscillator with an operating range of 1 MHz to 30 MHz.
 Two low power modes, Idle and Power-down.
 Processor wake-up from Power-down mode via external interrupt.
 Individual enable/disable of peripheral functions for power optimization.
 Dual power supply:
 CPU operating voltage range of 1.65 V to 1.95 V (1.8 V  0.15 V).
 I/O power supply range of 3.0 V to 3.6 V (3.3 V  10 %) with 5 V tolerant I/O pads.
3. Ordering information
Table 1.
Ordering information
Type number
LPC2109_2119_2129
Product data sheet
Package
Name
Description
Version
LPC2109FBD64/01
LQFP64
plastic low profile quad flat package; 64 leads;
body 10  10  1.4 mm
SOT314-2
LPC2119FBD64/01
LQFP64
plastic low profile quad flat package; 64 leads;
body 10  10  1.4 mm
SOT314-2
LPC2129FBD64/01
LQFP64
plastic low profile quad flat package; 64 leads;
body 10  10  1.4 mm
SOT314-2
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 14 June 2011
© NXP B.V. 2011. All rights reserved.
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LPC2109/2119/2129
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Single-chip 16/32-bit microcontrollers
3.1 Ordering options
Table 2.
Ordering options
Type number
LPC2109_2119_2129
Product data sheet
Flash
memory
RAM
CAN
Fast GPIO/ Temperature range
SSP/
Enhanced
UART, ADC,
Timer
LPC2109FBD64/01 64 kB
8 kB
1 channel
yes
40 C to +85 C
LPC2119FBD64/01
128 kB
16 kB
2 channels
yes
40 C to +85 C
LPC2129FBD64/01 256 kB
16 kB
2 channels
yes
40 C to +85 C
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Rev. 7 — 14 June 2011
© NXP B.V. 2011. All rights reserved.
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Single-chip 16/32-bit microcontrollers
4. Block diagram
TEST/DEBUG
INTERFACE
LPC2109
LPC2119
LPC2129
ARM7TDMI-S
P0[30:27],
P0[25:0]
P1[31:16]
HIGH-SPEED
GPI/O(4)
46 PINS TOTAL
AHB BRIDGE
EMULATION TRACE
MODULE
TMS(2) TDI(2) RTCK
TRST(2) TCK(2) TDO(2)
XTAL2
XTAL1
RESET
SYSTEM
FUNCTIONS
PLL
system
clock
VDD(3V3)
VDD(1V8)
VSS
VECTORED
INTERRUPT
CONTROLLER
AMBA Advanced High-performance
Bus (AHB)
ARM7 LOCAL BUS
INTERNAL
SRAM
CONTROLLER
INTERNAL
FLASH
CONTROLLER
8/16 kB
SRAM
64/128/256 kB
FLASH
AHB TO APB
BRIDGE
AHB
DECODER
APB
DIVIDER
SCL(1)
I2C-BUS SERIAL
INTERFACE
SDA(1)
SCK1(1)
EXTERNAL
INTERRUPTS
EINT[3:0](1)
SPI1/SSP(4) SERIAL
MOSI1(1)
INTERFACE
MISO1(1)
SSEL1(1)
4 × CAP0(1)
4 × CAP1(1)
4 × MAT0(1)
4 × MAT1(1)
CAPTURE/
COMPARE
TIMER 0/TIMER 1
AIN[3:0](1)
A/D CONVERTER
SCK0(1)
MOSI0(1)
SPI0 SERIAL
INTERFACE
MISO0(1)
SSEL0(1)
TXD[1:0](1)
RXD[1:0](1)
UART0/UART1
P0[30:27],
P0[25:0]
DSR1(1), CTS1(1),
RTS1(1), DTR1(1),
DCD1(1), RI1(1)
GENERAL
PURPOSE I/O
WATCHDOG
TIMER
P1[31:16]
PWM0
SYSTEM
CONTROL
CAN INTERFACE 1 AND 2
ACCEPTANCE FILTERS(3)
REAL-TIME CLOCK
PWM[6:1](1)
RD[2:1](1)
TD[2:1](1)
002aad172
(1) Shared with GPIO.
(2) When test/debug interface is used, GPIO/other functions sharing these pins are not available.
(3) Only 1 for LPC2109.
(4) SSP interface and high-speed GPIO are available on LPC2109/01, LPC2119/01, and LPC2129/01 only.
Fig 1. Block diagram
LPC2109_2119_2129
Product data sheet
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Rev. 7 — 14 June 2011
© NXP B.V. 2011. All rights reserved.
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5. Pinning information
49 VDD(1V8)
50 VSS
51 VDD(3V3)
52 P1[30]/TMS
53 P0[18]/CAP1[3]/MISO1/MAT1[3]
54 P0[19]/MAT1[2]/MOSI1/CAP1[2]
55 P0[20]/MAT1[3]/SSEL1/EINT3
56 P1[29]/TCK
57 RESET
58 VSSA(PLL)
59 VSSA
60 P1[28]/TDI
61 XTAL2
62 XTAL1
63 VDDA(1V8)
64 P1[27]/TDO
5.1 Pinning
P0[21]/PWM5/CAP1[3]
1
48 P1[20]/TRACESYNC
P0[22]/CAP0[0]/MAT0[0]
2
47 P0[17]/CAP1[2]/SCK1/MAT1[2]
P0[23]/RD2(1)
3
46 P0[16]/EINT0/MAT0[2]/CAP0[2]
P1[19]/TRACEPKT3
4
45 P0[15]/RI1/EINT2
P0[24]/TD2(1)
5
44 P1[21]/PIPESTAT0
VSS
6
43 VDD(3V3)
VDDA(3V3)
7
P1[18]/TRACEPKT2
8
P0[25]/RD1
9
42 VSS
LPC2109
LPC2119
LPC2129(2)
41 P0[14]/DCD1/EINT1
40 P1[22]/PIPESTAT1
TD1 10
39 P0[13]/DTR1/MAT1[1]
P0[27]/AIN0/CAP0[1]/MAT0[1] 11
38 P0[12]/DSR1/MAT1[0]
P1[17]/TRACEPKT1 12
37 P0[11]/CTS1/CAP1[1]
P0[28]/AIN1/CAP0[2]/MAT0[2] 13
36 P1[23]/PIPESTAT2
P0[29]/AIN2/CAP0[3]/MAT0[3] 14
35 P0[10]/RTS1/CAP1[0]
P0[30]/AIN3/EINT3/CAP0[0] 15
34 P0[9]/RXD1/PWM6/EINT3
P1[16]/TRACEPKT0 16
P1[24]/TRACECLK 32
P0[7]/SSEL0/PWM2/EINT2 31
P0[6]/MOSI0/CAP0[2] 30
P0[5]/MISO0/MAT0[1] 29
P1[25]/EXTIN0 28
P0[4]/SCK0/CAP0[1] 27
P0[3]/SDA/MAT0[0]/EINT1 26
VSS 25
P1[26]/RTCK 24
VDD(3V3) 23
P0[2]/SCL/CAP0[0] 22
P0[1]/RXD0/PWM3/EINT0 21
P1[31]/TRST 20
P0[0]/TXD0/PWM1 19
VSS 18
VDD(1V8) 17
33 P0[8]/TXD1/PWM4
002aad173
(1) No TD2 and RD2 for LPC2109.
(2) Pin configuration is identical for devices with and without /00 and /01 suffixes.
Fig 2. Pin configuration
LPC2109_2119_2129
Product data sheet
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Rev. 7 — 14 June 2011
© NXP B.V. 2011. All rights reserved.
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Single-chip 16/32-bit microcontrollers
5.2 Pin description
Table 3.
Pin description
Symbol
Pin
P0[0] to P0[31]
P0[0]/TXD0/
PWM1
19
P0[1]/RXD0/
PWM3/EINT0
21
P0[2]/SCL/
CAP0[0]
22
P0[3]/SDA/
MAT0[0]/EINT1
26
Type Description
I/O
Port 0 is a 32-bit bidirectional I/O port with individual direction controls for each bit.
The operation of port 0 pins depends upon the pin function selected via the Pin
Connect Block. Pins 26 and 31 of port 0 are not available.
O
TXD0 — Transmitter output for UART0.
O
PWM1 — Pulse Width Modulator output 1.
I
RXD0 — Receiver input for UART0.
O
PWM3 — Pulse Width Modulator output 3.
I
EINT0 — External interrupt 0 input
I/O
SCL — I2C-bus clock input/output. Open-drain output (for I2C-bus compliance).
I
CAP0[0] — Capture input for Timer 0, channel 0.
I/O
SDA — I2C-bus data input/output. Open-drain output (for I2C-bus compliance).
O
MAT0[0] — Match output for Timer 0, channel 0.
I
EINT1 — External interrupt 1 input.
SCK0 — Serial clock for SPI0. SPI clock output from master or input to slave.
P0[4]/SCK0/
CAP0[1]
27
I/O
I
CAP0[1] — Capture input for Timer 0, channel 1.
P0[5]/MISO0/
MAT0[1]
29
I/O
MISO0 — Master In Slave OUT for SPI0. Data input to SPI master or data output
from SPI slave.
O
MAT0[1] — Match output for Timer 0, channel 1.
I/O
MOSI0 — Master Out Slave In for SPI0. Data output from SPI master or data input
to SPI slave.
I
CAP0[2] — Capture input for Timer 0, channel 2.
I
SSEL0 — Slave Select for SPI0. Selects the SPI interface as a slave.
O
PWM2 — Pulse Width Modulator output 2.
I
EINT2 — External interrupt 2 input.
O
TXD1 — Transmitter output for UART1.
O
PWM4 — Pulse Width Modulator output 4.
P0[6]/MOSI0/
CAP0[2]
P0[7]/SSEL0/
PWM2/EINT2
30
31
P0[8]/TXD1/
PWM4
33
P0[9]/RXD1/
PWM6/EINT3
34
I
RXD1 — Receiver input for UART1.
O
PWM6 — Pulse Width Modulator output 6.
I
EINT3 — External interrupt 3 input.
P0[10]/RTS1/
CAP1[0]
35
O
RTS1 — Request to Send output for UART1.
I
CAP1[0] — Capture input for Timer 1, channel 0.
P0[11]/CTS1/
CAP1[1]
37
I
CTS1 — Clear to Send input for UART1.
I
CAP1[1] — Capture input for Timer 1, channel 1.
P0[12]/DSR1/
MAT1[0]
38
I
DSR1 — Data Set Ready input for UART1.
O
MAT1[0] — Match output for Timer 1, channel 0.
P0[13]/DTR1/
MAT1[1]
39
O
DTR1 — Data Terminal Ready output for UART1.
O
MAT1[1] — Match output for Timer 1, channel 1.
P0[14]/DCD1/
EINT1
41
I
DCD1 — Data Carrier Detect input for UART1.
I
EINT1 — External interrupt 1 input.
Note: LOW on this pin while RESET is LOW forces on-chip bootloader to take
control of the part after reset.
LPC2109_2119_2129
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 14 June 2011
© NXP B.V. 2011. All rights reserved.
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Single-chip 16/32-bit microcontrollers
Table 3.
Pin description …continued
Symbol
Pin
Type Description
P0[15]/RI1/EINT2
45
I
RI1 — Ring Indicator input for UART1.
I
EINT2 — External interrupt 2 input.
I
EINT0 — External interrupt 0 input.
O
MAT0[2] — Match output for Timer 0, channel 2.
I
CAP0[2] — Capture input for Timer 0, channel 2.
I
CAP1[2] — Capture input for Timer 1, channel 2.
I/O
SCK1 — Serial Clock for SPI1/SSP[1]. SPI clock output from master or input to
slave.
O
MAT1[2] — Match output for Timer 1, channel 2.
I
CAP1[3] — Capture input for Timer 1, channel 3.
I/O
MISO1 — Master In Slave Out for SPI1/SSP[1]. Data input to SPI master or data
output from SPI slave.
O
MAT1[3] — Match output for Timer 1, channel 3.
O
MAT1[2] — Match output for Timer 1, channel 2.
I/O
MOSI1 — Master Out Slave In for SPI1/SSP[1]. Data output from SPI master or data
input to SPI slave.
I
CAP1[2] — Capture input for Timer 1, channel 2.
O
MAT1[3] — Match output for Timer 1, channel 3.
I
SSEL1 — Slave Select for SPI1/SSP[1]. Selects the SPI interface as a slave.
P0[16]/EINT0/
MAT0[2]/CAP0[2]
P0[17]/CAP1[2]/
SCK1/MAT1[2]
P0[18]/CAP1[3]/
MISO1/MAT1[3]
P0[19]/MAT1[2]/
MOSI1/CAP1[2]
46
47
53
54
P0[20]/MAT1[3]/
SSEL1/EINT3
55
P0[21]/PWM5/
CAP1[3]
1
P0[22]/CAP0[0]/
MAT0[0]
I
EINT3 — External interrupt 3 input.
O
PWM5 — Pulse Width Modulator output 5.
I
CAP1[3] — Capture input for Timer 1, channel 3.
2
I
CAP0[0] — Capture input for Timer 0, channel 0.
O
MAT0[0] — Match output for Timer 0, channel 0.
P0[23]/RD2
3
I
CAN2 receiver input (not available on LPC2109).
P0[24]/TD2
5
O
CAN2 transmitter output (not available on LPC2109).
P0[25]/RD1
9
I
CAN1 receiver input.
P0[27]/AIN0/
CAP0[1]/MAT0[1]
11
I
AIN0 — A/D converter, input 0. This analog input is always connected to its pin.
I
CAP0[1] — Capture input for Timer 0, channel 1.
O
MAT0[1] — Match output for Timer 0, channel 1.
I
AIN1 — A/D converter, input 1. This analog input is always connected to its pin.
I
CAP0[2] — Capture input for Timer 0, channel 2.
O
MAT0[2] — Match output for Timer 0, channel 2.
I
AIN2 — A/D converter, input 2. This analog input is always connected to its pin.
I
CAP0[3] — Capture input for Timer 0, Channel 3.
P0[28]/AIN1/
CAP0[2]/MAT0[2]
13
P0[29]/AIN2/
CAP0[3]/MAT0[3]
14
P0[30]/AIN3/
EINT3/CAP0[0]
15
P1[0] to P1[31]
LPC2109_2119_2129
Product data sheet
O
MAT0[3] — Match output for Timer 0, channel 3.
I
AIN3 — A/D converter, input 3. This analog input is always connected to its pin.
I
EINT3 — External interrupt 3 input.
I
CAP0[0] — Capture input for Timer 0, channel 0.
I/O
Port 1 is a 32-bit bidirectional I/O port with individual direction controls for each bit.
The operation of port 1 pins depends upon the pin function selected via the Pin
Connect Block. Pins 0 through 15 of port 1 are not available.
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Rev. 7 — 14 June 2011
© NXP B.V. 2011. All rights reserved.
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Single-chip 16/32-bit microcontrollers
Table 3.
Pin description …continued
Symbol
Pin
Type Description
P1[16]/
TRACEPKT0
16
O
Trace Packet, bit 0. Standard I/O port with internal pull-up.
P1[17]/
TRACEPKT1
12
O
Trace Packet, bit 1. Standard I/O port with internal pull-up.
P1[18]/
TRACEPKT2
8
O
Trace Packet, bit 2. Standard I/O port with internal pull-up.
P1[19]/
TRACEPKT3
4
O
Trace Packet, bit 3. Standard I/O port with internal pull-up.
P1[20]/
TRACESYNC
48
O
Trace Synchronization. Standard I/O port with internal pull-up.
P1[21]/
PIPESTAT0
44
O
Pipeline Status, bit 0. Standard I/O port with internal pull-up.
P1[22]/
PIPESTAT1
40
O
Pipeline Status, bit 1. Standard I/O port with internal pull-up.
P1[23]/
PIPESTAT2
36
O
Pipeline Status, bit 2. Standard I/O port with internal pull-up.
P1[24]/
TRACECLK
32
O
Trace Clock. Standard I/O port with internal pull-up.
P1[25]/EXTIN0
28
I
External Trigger Input. Standard I/O with internal pull-up.
P1[26]/RTCK
24
I/O
Returned Test Clock output. Extra signal added to the JTAG port. Assists debugger
synchronization when processor frequency varies. Bidirectional pin with internal
pull-up.
Note: LOW on this pin while RESET is LOW, enables pins P1[25:16] to operate as
Trace port after reset.
Note: LOW on this pin while RESET is LOW, enables pins P1[31:26] to operate as
Debug port after reset.
P1[27]/TDO
64
O
Test Data out for JTAG interface.
P1[28]/TDI
60
I
Test Data in for JTAG interface.
P1[29]/TCK
56
I
Test Clock for JTAG interface. This clock must be slower than 1⁄6 of the CPU clock
(CCLK) for the JTAG interface to operate.
P1[30]/TMS
52
I
Test Mode Select for JTAG interface.
P1[31]/TRST
20
I
Test Reset for JTAG interface.
TD1
10
O
CAN1 transmitter output.
RESET
57
I
External reset input; a LOW on this pin resets the device, causing I/O ports and
peripherals to take on their default states, and processor execution to begin at
address 0. TTL with hysteresis, 5 V tolerant.
XTAL1
62
I
Input to the oscillator circuit and internal clock generator circuits.
XTAL2
61
O
Output from the oscillator amplifier.
VSS
6, 18, 25,
42, 50
I
Ground: 0 V reference.
VSSA
59
I
Analog ground; 0 V reference. This should nominally be the same voltage as VSS,
but should be isolated to minimize noise and error.
VSSA(PLL)
58
I
PLL analog ground; 0 V reference. This should nominally be the same voltage as
VSS, but should be isolated to minimize noise and error.
VDD(1V8)
17, 49
I
1.8 V core power supply; this is the power supply voltage for internal circuitry.
LPC2109_2119_2129
Product data sheet
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Rev. 7 — 14 June 2011
© NXP B.V. 2011. All rights reserved.
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Table 3.
Pin description …continued
Symbol
Pin
Type Description
VDDA(1V8)
63
I
Analog 1.8 V core power supply; this is the power supply voltage for internal
circuitry. This should be nominally the same voltage as VDD(1V8) but should be
isolated to minimize noise and error.
VDD(3V3)
23, 43, 51
I
3.3 V pad power supply; this is the power supply voltage for the I/O ports.
VDDA(3V3)
7
I
Analog 3.3 V pad power supply; this should be nominally the same voltage as
VDD(3V3) but should be isolated to minimize noise and error.
[1]
SSP interface available on LPC2109/01, LPC2119/01, and LPC2129/01 only.
LPC2109_2119_2129
Product data sheet
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Rev. 7 — 14 June 2011
© NXP B.V. 2011. All rights reserved.
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LPC2109/2119/2129
NXP Semiconductors
Single-chip 16/32-bit microcontrollers
6. Functional description
Details of the LPC2109/2119/2129 systems and peripheral functions are described in the
following sections.
6.1 Architectural overview
The ARM7TDMI-S is a general purpose 32-bit microprocessor, which offers high
performance and very low power consumption. The ARM architecture is based on
Reduced Instruction Set Computer (RISC) principles, and the instruction set and related
decode mechanism are much simpler than those of microprogrammed Complex
Instruction Set Computers. This simplicity results in a high instruction throughput and
impressive real-time interrupt response from a small and cost-effective processor core.
Pipeline techniques are employed so that all parts of the processing and memory systems
can operate continuously. Typically, while one instruction is being executed, its successor
is being decoded, and a third instruction is being fetched from memory.
The ARM7TDMI-S processor also employs a unique architectural strategy known as
Thumb, which makes it ideally suited to high-volume applications with memory
restrictions, or applications where code density is an issue.
The key idea behind Thumb is that of a super-reduced instruction set. Essentially, the
ARM7TDMI-S processor has two instruction sets:
• The standard 32-bit ARM set.
• A 16-bit Thumb set.
The Thumb set’s 16-bit instruction length allows it to approach twice the density of
standard ARM code while retaining most of the ARM’s performance advantage over a
traditional 16-bit processor using 16-bit registers. This is possible because Thumb code
operates on the same 32-bit register set as ARM code.
Thumb code is able to provide up to 65 % of the code size of ARM, and 160 % of the
performance of an equivalent ARM processor connected to a 16-bit memory system.
6.2 On-chip flash program memory
The LPC2109/2119/2129 incorporate a 64/128/256 kB flash memory system, respectively.
This memory may be used for both code and data storage. Programming of the flash
memory may be accomplished in several ways. It may be programmed In System via the
serial port. The application program may also erase and/or program the flash while the
application is running, allowing a great degree of flexibility for data storage field firmware
upgrades, etc. When on-chip bootloader is used, 60/120/248 kB of flash memory is
available for user code.
The LPC2109/2119/2129 flash memory provides a minimum of 100000 erase/write cycles
and 20 years of data retention.
On-chip bootloader (as of revision 1.60) provides Code Read Protection (CRP) for the
LPC2109/2119/2129 on-chip flash memory. When the CRP is enabled, the JTAG debug
port and ISP commands accessing either the on-chip RAM or flash memory are disabled.
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However, the ISP flash erase command can be executed at any time (no matter whether
the CRP is on or off). Removal of CRP is achieved by erasure of full on-chip user flash.
With the CRP off, full access to the chip via the JTAG and/or ISP is restored.
6.3 On-chip SRAM
On-chip SRAM may be used for code and/or data storage. The SRAM may be accessed
as 8 bit, 16 bit, and 32 bit. The LPC2109/2119/2129 provide 8 kB of SRAM for the
LPC2109 and 16 kB for the LPC2119 and LPC2129.
6.4 Memory map
The LPC2109/2119/2129 memory maps incorporate several distinct regions, as shown in
Figure 3.
In addition, the CPU interrupt vectors may be re-mapped to allow them to reside in either
flash memory (the default) or on-chip SRAM. This is described in Section 6.18 “System
control”.
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4.0 GB
0xFFFF FFFF
AHB PERIPHERALS
3.75 GB
APB PERIPHERALS
0xF000 0000
0xEFFF FFFF
3.5 GB
0xE000 0000
0xDFFF FFFF
3.0 GB
0xC000 0000
RESERVED ADDRESS SPACE
2.0 GB
BOOT BLOCK (RE-MAPPED FROM
ON-CHIP FLASH MEMORY)
0x8000 0000
0x7FFF FFFF
0x7FFF E000
0x7FFF DFFF
RESERVED ADDRESS SPACE
0x4000 4000
0x4000 3FFF
16 kB ON-CHIP STATIC RAM (LPC2119/2129)
0x4000 1FFF
8 kB ON-CHIP STATIC RAM (LPC2109)
1.0 GB
0x4000 0000
0x3FFF FFFF
RESERVED ADDRESS SPACE
0x0004 0000
0x0003 FFFF
256 kB ON-CHIP FLASH MEMORY (LPC2129)
128 kB ON-CHIP FLASH MEMORY (LPC2119)
64 kB ON-CHIP FLASH MEMORY (LPC2109)
0.0 GB
0x0002 0000
0x0001 FFFF
0x0001 0000
0x0000 FFFF
0x0000 0000
002aad174
Fig 3. LPC2109/2119/2129 memory map
6.5 Interrupt controller
The Vectored Interrupt Controller (VIC) accepts all of the interrupt request inputs and
categorizes them as Fast Interrupt reQuest (FIQ), vectored Interrupt reQuest (IRQ), and
non-vectored IRQ as defined by programmable settings. The programmable assignment
scheme means that priorities of interrupts from the various peripherals can be dynamically
assigned and adjusted.
FIQ has the highest priority. If more than one request is assigned to FIQ, the VIC
combines the requests to produce the FIQ signal to the ARM processor. The fastest
possible FIQ latency is achieved when only one request is classified as FIQ because then
the FIQ service routine can simply start dealing with that device. But if more than one
request is assigned to the FIQ class, the FIQ service routine can read a word from the VIC
that identifies which FIQ source(s) is (are) requesting an interrupt.
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Vectored IRQs have the middle priority. Sixteen of the interrupt requests can be assigned
to this category. Any of the interrupt requests can be assigned to any of the 16 vectored
IRQ slots, among which slot 0 has the highest priority and slot 15 has the lowest.
Non-vectored IRQs have the lowest priority.
The VIC combines the requests from all the vectored and non-vectored IRQs to produce
the IRQ signal to the ARM processor. The IRQ service routine can start by reading a
register from the VIC and jumping there. If any of the vectored IRQs are requesting, the
VIC provides the address of the highest-priority requesting IRQs service routine,
otherwise it provides the address of a default routine that is shared by all the non-vectored
IRQs. The default routine can read another VIC register to see what IRQs are active.
6.5.1 Interrupt sources
Table 4 lists the interrupt sources for each peripheral function. Each peripheral device has
one interrupt line connected to the Vectored Interrupt Controller, but may have several
internal interrupt flags. Individual interrupt flags may also represent more than one
interrupt source.
Table 4.
Interrupt sources
Block
Flag(s)
VIC channel #
WDT
Watchdog Interrupt (WDINT)
0
-
Reserved for software interrupts only
1
ARM Core
EmbeddedICE, DbgCommRx
2
ARM Core
EmbeddedICE, DbgCommTx
3
Timer 0
Match 0 to 3 (MR0, MR1, MR2, MR3)
4
Timer 1
Match 0 to 3 (MR0, MR1, MR2, MR3)
Capture 0 to 3 (CR0, CR1, CR2, CR3)
5
Capture 0 to 3 (CR0, CR1, CR2, CR3)
UART0
Rx Line Status (RLS)
6
Transmit Holding Register empty (THRE)
Rx Data Available (RDA)
Character Time-out Indicator (CTI)
UART1
Rx Line Status (RLS)
7
Transmit Holding Register empty (THRE)
Rx Data Available (RDA)
Character Time-out Indicator (CTI)
Modem Status Interrupt (MSI)
PWM0
Match 0 to 6 (MR0, MR1, MR2, MR3, MR4, MR5, MR6)
8
I2C-bus
SI (state change)
9
SPIF, MODF
10
SPIF, MODF and TXRIS, RXRIS, RTRIS, RORRIS
11
PLL
PLL Lock (PLOCK)
12
RTC
RTCCIF (Counter Increment), RTCALF (Alarm)
13
SPI0
SPI1 and
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Table 4.
Interrupt sources …continued
Block
Flag(s)
VIC channel #
System Control
External Interrupt 0 (EINT0)
14
External Interrupt 1 (EINT1)
15
External Interrupt 2 (EINT2)
16
External Interrupt 3 (EINT3)
17
ADC
A/D Converter
18
CAN
CAN1, CAN2 and Acceptance Filter
19 to 23
[1]
SSP interface available on LPC2109/01, LPC2119/01, and LPC2129/01 only.
6.6 Pin connect block
The pin connect block allows selected pins of the microcontroller to have more than one
function. Configuration registers control the multiplexers to allow connection between the
pin and the on-chip peripherals. Peripherals should be connected to the appropriate pins
prior to being activated, and prior to any related interrupt(s) being enabled. Activity of any
enabled peripheral function that is not mapped to a related pin should be considered
undefined.
6.7 General purpose parallel I/O (GPIO) and Fast I/O
Device pins that are not connected to a specific peripheral function are controlled by the
parallel I/O registers. Pins may be dynamically configured as inputs or outputs. Separate
registers allow setting or clearing any number of outputs simultaneously. The value of the
output register may be read back, as well as the current state of the port pins.
6.7.1 Features
• Bit-level set and clear registers allow a single instruction set or clear of any number of
bits in one port.
• Direction control of individual bits.
• Separate control of output set and clear.
• All I/O default to inputs after reset.
6.7.2 Features added with the Fast GPIO set of registers available on
LPC2109/2119/2129/01 only
• Fast GPIO registers are relocated to the ARM local bus for the fastest possible I/O
timing, enabling port pin toggling up to 3.5 times faster than earlier LPC2000 devices.
• Mask registers allow treating sets of port bits as a group, leaving other bits
unchanged.
• All Fast GPIO registers are byte addressable.
• Entire port value can be written in one instruction.
• Ports are accessible via either the legacy group of registers (GPIOs) or the group of
registers providing accelerated port access (Fast GPIOs).
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6.8 10-bit ADC
The LPC2109/2119/2129 each contain a single 10-bit successive approximation ADC with
four multiplexed channels.
6.8.1 Features
•
•
•
•
Measurement range of 0 V to 3 V.
Capable of performing more than 400000 10-bit samples per second.
Burst conversion mode for single or multiple inputs.
Optional conversion on transition on input pin or Timer Match signal.
6.8.2 ADC features available in LPC2109/2119/2129/01 only
• Every analog input has a dedicated result register to reduce interrupt overhead.
• Every analog input can generate an interrupt once the conversion is completed.
• The ADC pads are 5 V tolerant when configured for digital I/O function(s).
6.9 CAN controllers and acceptance filter
The LPC2119 and LPC2129 each contain two CAN controllers, while the LPC2109 has
one CAN controller. The CAN is a serial communications protocol which efficiently
supports distributed real-time control with a very high level of security. Its domain of
application ranges from high-speed networks to low-cost multiplex wiring.
6.9.1 Features
•
•
•
•
•
Data rates up to 1 Mbit/s on each bus.
32-bit register and RAM access.
Compatible with CAN specification 2.0 B, ISO 11898-1.
Global Acceptance Filter recognizes 11-bit and 29-bit Rx identifiers for all CAN buses.
Acceptance Filter can provide FullCAN-style automatic reception for selected
Standard identifiers.
6.10 UARTs
The LPC2109/2119/2129 each contain two UARTs. In addition to standard transmit and
receive data lines, the UART1 also provides a full modem control handshake interface.
6.10.1 Features
•
•
•
•
16 B Receive and Transmit FIFOs.
Register locations conform to 16C550 industry standard.
Receiver FIFO trigger points at 1 B, 4 B, 8 B, and 14 B.
Built-in fractional baud rate generator covering wide range of baud rates without a
need for external crystals of particular values.
• Transmission FIFO control enables implementation of software (XON/XOFF) flow
control on both UARTs.
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• UART1 is equipped with standard modem interface signals. This module also
provides full support for hardware flow control (auto-CTS/RTS).
6.10.2 UART features available in LPC2109/2119/2129/01 only
Compared to previous LPC2000 microcontrollers, UARTs in LPC2109/2119/2129/01
introduce a fractional baud rate generator for both UARTs, enabling these microcontrollers
to achieve standard baud rates such as 115200 Bd with any crystal frequency above
2 MHz. In addition, auto-CTS/RTS flow-control functions are fully implemented in
hardware.
• Fractional baud rate generator enables standard baud rates such as 115200 Bd to be
achieved with any crystal frequency above 2 MHz.
• Auto-bauding.
• Auto-CTS/RTS flow-control fully implemented in hardware.
6.11 I2C-bus serial I/O controller
The I2C-bus is a bidirectional bus for inter-IC control using only two wires: a serial clock
line (SCL), and a serial data line (SDA). Each device is recognized by a unique address
and can operate as either a receiver-only device (e.g. an LCD driver or a transmitter with
the capability to both receive and send information (such as memory). Transmitters and/or
receivers can operate in either master or slave mode, depending on whether the chip has
to initiate a data transfer or is only addressed. The I2C-bus is a multi-master bus; it can be
controlled by more than one bus master connected to it.
The I2C-bus implemented in LPC2109/2119/2129 supports a bit rate up to 400 kbit/s (Fast
I2C-bus).
6.11.1 Features
• Standard I2C-bus compliant interface.
• Easy to configure as Master, Slave, or Master/Slave.
• Programmable clocks allow versatile rate control.
• Bidirectional data transfer between masters and slaves.
• Multi-master bus (no central master).
• Arbitration between simultaneously transmitting masters without corruption of serial
data on the bus.
• Serial clock synchronization allows devices with different bit rates to communicate via
one serial bus.
• Serial clock synchronization can be used as a handshake mechanism to suspend and
resume serial transfer.
• The I2C-bus may be used for test and diagnostic purposes.
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6.12 SPI serial I/O controller
The LPC2109/2119/2129 each contain two SPIs. The SPI is a full duplex serial interface,
designed to be able to handle multiple masters and slaves connected to a given bus. Only
a single master and a single slave can communicate on the interface during a given data
transfer. During a data transfer the master always sends a byte of data to the slave, and
the slave always sends a byte of data to the master.
6.12.1 Features
• Compliant with Serial Peripheral Interface (SPI) specification.
• Synchronous, Serial, Full Duplex communication.
• Combined SPI master and slave.
• Maximum data bit rate of 1⁄8 of the input clock rate.
6.12.2 Features available in LPC2109/2119/2129/01 only
• Eight to 16 bits per frame.
• When the SPI interface is used in Master mode, the SSELn pin is not needed (can be
used for a different function).
6.13 SSP controller (LPC2109/2119/2129/01 only)
Remark: This peripheral is available in LPC2109/2119/2129/01 only.
The SSP is a controller capable of operation on a SPI, 4-wire SSI, or Microwire bus. It can
interact with multiple masters and slaves on the bus. Only a single master and a single
slave can communicate on the bus during a given data transfer. Data transfers are in
principle full duplex, with frames of four to 16 bits of data flowing from the master to the
slave and from the slave to the master.
While the SSP and SPI1 peripherals share the same physical pins, it is not possible to
have both of these two peripherals active at the same time. Application can switch on the
fly from SPI1 to SSP and back.
6.13.1 Features
• Compatible with Motorola’s SPI, Texas Instrument’s 4-wire SSI, and National
Semiconductor’s Microwire buses.
•
•
•
•
Synchronous serial communication.
Master or slave operation.
8-frame FIFOs for both transmit and receive.
Four to 16 bits per frame.
6.14 General purpose timers
The Timer/Counter is designed to count cycles of the peripheral clock (PCLK) or an
externally supplied clock and optionally generate interrupts or perform other actions at
specified timer values, based on four match registers. It also includes four capture inputs
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to trap the timer value when an input signal transitions, optionally generating an interrupt.
Multiple pins can be selected to perform a single capture or match function, providing an
application with ‘or’ and ‘and’, as well as ‘broadcast’ functions among them.
6.14.1 Features
• A 32-bit Timer/Counter with a programmable 32-bit Prescaler.
• Timer or external event counter operation
• Four 32-bit capture channels per timer that can take a snapshot of the timer value
when an input signal transitions. A capture event may also optionally generate an
interrupt.
• Four 32-bit match registers that allow:
– Continuous operation with optional interrupt generation on match.
– Stop timer on match with optional interrupt generation.
– Reset timer on match with optional interrupt generation.
• Four external outputs per timer corresponding to match registers, with the following
capabilities:
– Set LOW on match.
– Set HIGH on match.
– Toggle on match.
– Do nothing on match.
6.14.2 Features available in LPC2109/2119/2129/01 only
The LPC2109/2119/2129/01 can count external events on one of the capture inputs if the
external pulse lasts at least one half of the period of the PCLK. In this configuration,
unused capture lines can be selected as regular timer capture inputs, or used as external
interrupts.
• Timer can count cycles of either the peripheral clock (PCLK) or an externally supplied
clock.
• When counting cycles of an externally supplied clock, only one of the timer’s capture
inputs can be selected as the timer’s clock. The rate of such a clock is limited to
PCLK / 4. Duration of HIGH/LOW levels on the selected CAPn input cannot be
shorter than 1 / (2PCLK).
6.15 Watchdog timer
The purpose of the watchdog is to reset the microcontroller within a reasonable amount of
time if it enters an erroneous state. When enabled, the watchdog will generate a system
reset if the user program fails to ‘feed’ (or reload) the watchdog within a predetermined
amount of time.
6.15.1 Features
• Internally resets chip if not periodically reloaded.
• Debug mode.
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• Enabled by software but requires a hardware reset or a watchdog reset/interrupt to be
disabled.
• Incorrect/incomplete feed sequence causes reset/interrupt if enabled.
• Flag to indicate watchdog reset.
• Programmable 32-bit timer with internal pre-scaler.
• Selectable time period from (Tcy(PCLK)  256  4) to (Tcy(PCLK)  232  4) in multiples of
Tcy(PCLK)  4.
6.16 Real-time clock
The RTC is designed to provide a set of counters to measure time when normal or idle
operating mode is selected. The RTC has been designed to use little power, making it
suitable for battery powered systems where the CPU is not running continuously (Idle
mode).
6.16.1 Features
• Measures the passage of time to maintain a calendar and clock.
• Ultra low power design to support battery powered systems.
• Provides Seconds, Minutes, Hours, Day of Month, Month, Year, Day of Week, and
Day of Year.
• Programmable reference clock divider allows adjustment of the RTC to match various
crystal frequencies.
6.17 Pulse width modulator
The PWM is based on the standard Timer block and inherits all of its features, although
only the PWM function is pinned out on the LPC2109/2119/2129. The Timer is designed to
count cycles of the peripheral clock (PCLK) and optionally generate interrupts or perform
other actions when specified timer values occur, based on seven match registers. The
PWM function is also based on match register events.
The ability to separately control rising and falling edge locations allows the PWM to be
used for more applications. For instance, multi-phase motor control typically requires
three non-overlapping PWM outputs with individual control of all three pulse widths and
positions.
Two match registers can be used to provide a single edge controlled PWM output. One
match register (MR0) controls the PWM cycle rate, by resetting the count upon match.
The other match register controls the PWM edge position. Additional single edge
controlled PWM outputs require only one match register each, since the repetition rate is
the same for all PWM outputs. Multiple single edge controlled PWM outputs will all have a
rising edge at the beginning of each PWM cycle, when an MR0 match occurs.
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Three match registers can be used to provide a PWM output with both edges controlled.
Again, the MR0 match register controls the PWM cycle rate. The other match registers
control the two PWM edge positions. Additional double edge controlled PWM outputs
require only two match registers each, since the repetition rate is the same for all PWM
outputs.
With double edge controlled PWM outputs, specific match registers control the rising and
falling edge of the output. This allows both positive going PWM pulses (when the rising
edge occurs prior to the falling edge), and negative going PWM pulses (when the falling
edge occurs prior to the rising edge).
6.17.1 Features
• Seven match registers allow up to six single edge controlled or three double edge
controlled PWM outputs, or a mix of both types.
• The match registers also allow:
– Continuous operation with optional interrupt generation on match.
– Stop timer on match with optional interrupt generation.
– Reset timer on match with optional interrupt generation.
• Supports single edge controlled and/or double edge controlled PWM outputs. Single
edge controlled PWM outputs all go HIGH at the beginning of each cycle unless the
output is a constant LOW. Double edge controlled PWM outputs can have either edge
occur at any position within a cycle. This allows for both positive going and negative
going pulses.
• Pulse period and width can be any number of timer counts. This allows complete
flexibility in the trade-off between resolution and repetition rate. All PWM outputs will
occur at the same repetition rate.
• Double edge controlled PWM outputs can be programmed to be either positive going
or negative going pulses.
• Match register updates are synchronized with pulse outputs to prevent generation of
erroneous pulses. Software must ‘release’ new match values before they can become
effective.
• May be used as a standard timer if the PWM mode is not enabled.
• A 32-bit Timer/Counter with a programmable 32-bit Prescaler.
6.18 System control
6.18.1 Crystal oscillator
The oscillator supports crystals in the range of 1 MHz to 30 MHz. The oscillator output
frequency is called fosc and the ARM processor clock frequency is referred to as CCLK for
purposes of rate equations, etc.. fosc and CCLK are the same value unless the PLL is
running and connected. Refer to Section 6.18.2 “PLL” for additional information.
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6.18.2 PLL
The PLL accepts an input clock frequency in the range of 10 MHz to 25 MHz. The input
frequency is multiplied up into the range of 10 MHz to 60 MHz with a Current Controlled
Oscillator (CCO). The multiplier can be an integer value from 1 to 32 (in practice, the
multiplier value cannot be higher than 6 on this family of microcontrollers due to the upper
frequency limit of the CPU). The CCO operates in the range of 156 MHz to 320 MHz, so
there is an additional divider in the loop to keep the CCO within its frequency range while
the PLL is providing the desired output frequency. The output divider may be set to divide
by 2, 4, 8, or 16 to produce the output clock. Since the minimum output divider value is 2,
it is insured that the PLL output has a 50 % duty cycle. The PLL is turned off and
bypassed following a chip Reset and may be enabled by software. The program must
configure and activate the PLL, wait for the PLL to Lock, then connect to the PLL as a
clock source. The PLL settling time is 100 s.
6.18.3 Reset and wake-up timer
Reset has two sources on the LPC2109/2119/2129: the RESET pin and Watchdog Reset.
The RESET pin is a Schmitt trigger input pin with an additional glitch filter. Assertion of
chip Reset by any source starts the Wake-up Timer (see Wake-up Timer description
below), causing the internal chip reset to remain asserted until the external Reset is
de-asserted, the oscillator is running, a fixed number of clocks have passed, and the
on-chip flash controller has completed its initialization.
When the internal Reset is removed, the processor begins executing at address 0, which
is the Reset vector. At that point, all of the processor and peripheral registers have been
initialized to predetermined values.
The wake-up timer ensures that the oscillator and other analog functions required for chip
operation are fully functional before the processor is allowed to execute instructions. This
is important at power on, all types of Reset, and whenever any of the aforementioned
functions are turned off for any reason. Since the oscillator and other functions are turned
off during Power-down mode, any wake-up of the processor from Power-down mode
makes use of the Wake-up Timer.
The Wake-up Timer monitors the crystal oscillator as the means of checking whether it is
safe to begin code execution. When power is applied to the chip, or some event caused
the chip to exit Power-down mode, some time is required for the oscillator to produce a
signal of sufficient amplitude to drive the clock logic. The amount of time depends on
many factors, including the rate of VDD ramp (in the case of power on), the type of crystal
and its electrical characteristics (if a quartz crystal is used), as well as any other external
circuitry (e.g. capacitors), and the characteristics of the oscillator itself under the existing
ambient conditions.
6.18.4 Code security (Code Read Protection - CRP)
This feature of the LPC2109/2119/2129 allows the user to enable different levels of
security in the system so that access to the on-chip flash and use of the JTAG and ISP
can be restricted. When needed, CRP is invoked by programming a specific pattern into a
dedicated flash location. IAP commands are not affected by the CRP.
There are three levels of the Code Read Protection.
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CRP1 disables access to chip via the JTAG and allows partial flash update (excluding
flash sector 0) using a limited set of the ISP commands. This mode is useful when CRP is
required and flash field updates are needed but all sectors can not be erased.
CRP2 disables access to chip via the JTAG and only allows full flash erase and update
using a reduced set of the ISP commands.
Running an application with level CRP3 selected fully disables any access to chip via the
JTAG pins and the ISP. This mode effectively disables ISP override using P0[14] pin, too.
It is up to the user’s application to provide (if needed) flash update mechanism using IAP
calls or call reinvoke ISP command to enable flash update via UART0.
CAUTION
If level three Code Read Protection (CRP3) is selected, no future factory testing can be
performed on the device.
Remark: Devices without the suffix /00 or /01 have only a security level equivalent to
CRP2 available.
6.18.5 External interrupt inputs
The LPC2109/2119/2129 include up to nine edge or level sensitive External Interrupt
Inputs as selectable pin functions. When the pins are combined, external events can be
processed as four independent interrupt signals. The External Interrupt Inputs can
optionally be used to wake up the processor from Power-down mode.
6.18.6 Memory mapping control
The Memory Mapping Control alters the mapping of the interrupt vectors that appear
beginning at address 0x0000 0000. Vectors may be mapped to the bottom of the on-chip
flash memory, or to the on-chip SRAM. This allows code running in different memory
spaces to have control of the interrupts.
6.18.7 Power control
The LPC2109/2119/2129 support two reduced power modes: Idle mode and Power-down
mode. In Idle mode, execution of instructions is suspended until either a Reset or interrupt
occurs. Peripheral functions continue operation during Idle mode and may generate
interrupts to cause the processor to resume execution. Idle mode eliminates power used
by the processor itself, memory systems and related controllers, and internal buses.
In Power-down mode, the oscillator is shut down and the chip receives no internal clocks.
The processor state and registers, peripheral registers, and internal SRAM values are
preserved throughout Power-down mode and the logic levels of chip output pins remain
static. The Power-down mode can be terminated and normal operation resumed by either
a Reset or certain specific interrupts that are able to function without clocks. Since all
dynamic operation of the chip is suspended, Power-down mode reduces chip power
consumption to nearly zero.
A Power Control for Peripherals feature allows individual peripherals to be turned off if
they are not needed in the application, resulting in additional power savings.
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6.18.8 APB
The APB divider determines the relationship between the processor clock (CCLK) and the
clock used by peripheral devices (PCLK). The APB divider serves two purposes. The first
is to provide peripherals with the desired PCLK via APB so that they can operate at the
speed chosen for the ARM processor. In order to achieve this, the APB may be slowed
down to 1⁄2 to 1⁄4 of the processor clock rate. Because the APB must work properly at
power-up (and its timing cannot be altered if it does not work since the APB divider control
registers reside on the APB), the default condition at reset is for the APB to run at 1⁄4 of the
processor clock rate. The second purpose of the APB divider is to allow power savings
when an application does not require any peripherals to run at the full processor rate.
Because the APB divider is connected to the PLL output, the PLL remains active (if it was
running) during Idle mode.
6.19 Emulation and debugging
The LPC2109/2119/2129 support emulation and debugging via a JTAG serial port. A trace
port allows tracing program execution. Debugging and trace functions are multiplexed
only with GPIOs on Port 1. This means that all communication, timer and interface
peripherals residing on Port 0 are available during the development and debugging phase
as they are when the application is run in the embedded system itself.
6.19.1 EmbeddedICE
Standard ARM EmbeddedICE logic provides on-chip debug support. The debugging of
the target system requires a host computer running the debugger software and an
EmbeddedICE protocol convertor. EmbeddedICE protocol convertor converts the Remote
Debug Protocol commands to the JTAG data needed to access the ARM core.
The ARM core has a Debug Communication Channel function built-in. The debug
communication channel allows a program running on the target to communicate with the
host debugger or another separate host without stopping the program flow or even
entering the debug state. The debug communication channel is accessed as a
co-processor 14 by the program running on the ARM7TDMI-S core. The debug
communication channel allows the JTAG port to be used for sending and receiving data
without affecting the normal program flow. The debug communication channel data and
control registers are mapped in to addresses in the EmbeddedICE logic.
The JTAG clock (TCK) must be slower than 1⁄6 of the CPU clock (CCLK) for the JTAG
interface to operate.
6.19.2 Embedded trace macrocell
Since the LPC2109/2119/2129 have significant amounts of on-chip memory, it is not
possible to determine how the processor core is operating simply by observing the
external pins. The ETM provides real-time trace capability for deeply embedded
processor cores. It outputs information about processor execution to the trace port.
The ETM is connected directly to the ARM core and not to the main AMBA system bus. It
compresses the trace information and exports it through a narrow trace port. An external
trace port analyzer must capture the trace information under software debugger control.
Instruction trace (or PC trace) shows the flow of execution of the processor and provides a
list of all the instructions that were executed. Instruction trace is significantly compressed
by only broadcasting branch addresses as well as a set of status signals that indicate the
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pipeline status on a cycle by cycle basis. Trace information generation can be controlled
by selecting the trigger resource. Trigger resources include address comparators,
counters and sequencers. Since trace information is compressed the software debugger
requires a static image of the code being executed. Self-modifying code can not be traced
because of this restriction.
6.19.3 RealMonitor
RealMonitor is a configurable software module, developed by ARM Inc., which enables
real time debug. It is a lightweight debug monitor that runs in the background while users
debug their foreground application. It communicates with the host using the DCC (Debug
Communications Channel), which is present in the EmbeddedICE logic. The
LPC2109/2119/2129 contain a specific configuration of RealMonitor software
programmed into the on-chip flash memory.
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7. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).[1]
Symbol
Min
Max
Unit
supply voltage (1.8 V)
[2]
0.5
+2.5
V
VDD(3V3)
supply voltage (3.3 V)
[3]
0.5
+3.6
V
VDDA(3V3)
analog supply voltage (3.3 V)
0.5
+4.6
V
VIA
analog input voltage
VDD(1V8)
Parameter
Conditions
0.5
+5.1
V
5 V tolerant I/O pins
[4][5]
0.5
+6.0
V
other I/O pins
[4][6]
0.5
VDD(3V3) + 0.5
V
supply current
[7][8]
-
100
mA
ISS
ground current
[8][9]
-
100
mA
Tj
junction temperature
-
150
C
65
+150
C
-
1.5
W
2000
+2000
V
input voltage
VI
IDD
[10]
Tstg
storage temperature
Ptot(pack)
total power dissipation (per
package)
based on package heat
transfer, not device
power consumption
Vesd
electrostatic discharge voltage
human body model; all
pins
[1]
[11]
The following applies to Table 5:
a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive
static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated
maximum.
b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to VSS unless
otherwise noted.
[2]
Internal rail.
[3]
External rail.
[4]
Including voltage on outputs in 3-state mode.
[5]
Only valid when the VDD(3V3) supply voltage is present.
[6]
Not to exceed 4.6 V.
[7]
Per supply pin.
[8]
The peak current is limited to 25 times the corresponding maximum current.
[9]
Per ground pin.
[10] Dependent on package type.
[11] Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor.
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8. Static characteristics
Table 6.
Static characteristics
Tamb = 40 C to +85 C for industrial applications, unless otherwise specified.
Symbol
Parameter
Conditions
supply voltage (1.8 V)
[2]
VDD(3V3)
supply voltage (3.3 V)
[3]
VDDA(3V3)
analog supply voltage
(3.3 V)
VDD(1V8)
Min
Typ[1]
Max
Unit
1.65
1.8
1.95
V
3.0
3.3
3.6
V
2.5
3.3
3.6
V
Standard port pins, RESET, RTCK
IIL
LOW-level input current
VI = 0 V; no pull-up
-
-
3
A
IIH
HIGH-level input current
VI = VDD(3V3); no pull-down
-
-
3
A
IOZ
OFF-state output current
VO = 0 V; VO = VDD(3V3);
no pull-up/down
-
-
3
A
Ilatch
I/O latch-up current
(0.5VDD(3V3)) < VI <
(1.5VDD(3V3)); Tj < 125 C
100
-
-
mA
VI
input voltage
0
-
5.5
V
VO
output voltage
0
-
VDD(3V3)
V
VIH
HIGH-level input voltage
2.0
-
-
V
VIL
LOW-level input voltage
-
-
0.8
V
Vhys
hysteresis voltage
0.4
VOH
[4][5][6]
output active
-
-
V
HIGH-level output voltage IOH = 4 mA
[7]
VDD(3V3)  0.4 -
-
V
VOL
LOW-level output voltage
[7]
-
-
0.4
V
IOH
HIGH-level output current VOH = VDD(3V3)  0.4 V
[7]
4
-
-
mA
IOL
LOW-level output current
VOL = 0.4 V
[7]
4
-
-
mA
-
-
45
mA
IOL = 4 mA
IOHS
HIGH-level short-circuit
output current
VOH = 0 V
[8]
IOLS
LOW-level short-circuit
output current
VOL = VDD(3V3)
[8]
-
-
50
mA
Ipd
pull-down current
VI = 5 V
[9]
10
50
150
A
VI = 0 V
[10]
Ipu
pull-up current
VDD(3V3) < VI < 5 V
LPC2109_2119_2129
Product data sheet
[9]
15
50
85
A
0
0
0
A
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Table 6.
Static characteristics …continued
Tamb = 40 C to +85 C for industrial applications, unless otherwise specified.
Symbol
Typ[1]
Max
Unit
-
60
-
mA
Power-down mode supply VDD(1V8) = 1.8 V;
current
Tamb = 25 C
-
10
-
A
VDD(1V8) = 1.8 V;
Tamb = 85 C
-
110
500
A
-
41.5
-
mA
-
9
-
mA
Power-down mode supply VDD(1V8) = 1.8 V;
current
Tamb = 25 C
-
10
-
A
VDD(1V8) = 1.8 V;
Tamb = 85 C
-
110
500
A
V
Parameter
Conditions
Min
Power consumption LPC2109/00, LPC2119, LPC2119/00, LPC2129, LPC2129/00
IDD(act)
active mode supply
current
VDD(1V8) = 1.8 V;
CCLK = 60 MHz;
Tamb = 25 C; code
while(1){}
executed from flash; all
peripherals enabled via
PCONP[11] register but not
configured to run
IDD(pd)
Power consumption LPC2109/01, LPC2119/01, LPC2129/01
IDD(act)
active mode supply
current
VDD(1V8) = 1.8 V;
CCLK = 60 MHz;
Tamb = 25 C; code
while(1){}
executed from flash; all
peripherals enabled via
PCONP[11] register but not
configured to run
IDD(idle)
Idle mode supply current
VDD(1V8) = 1.8 V;
CCLK = 60 MHz;
Tamb = 25 C;
executed from flash; all
peripherals enabled via
PCONP[11] register but not
configured to run
IDD(pd)
I2C-bus pins
VIH
HIGH-level input voltage
0.7VDD(3V3)
-
-
VIL
LOW-level input voltage
-
-
0.3VDD(3V3) V
Vhys
hysteresis voltage
-
0.05VDD(3V3) -
V
IOLS = 3 mA
[7]
-
-
0.4
V
VI = VDD(3V3)
[12]
-
2
4
A
-
10
22
A
VOL
ILI
LOW-level output voltage
input leakage current
VI = 5 V
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Table 6.
Static characteristics …continued
Tamb = 40 C to +85 C for industrial applications, unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ[1]
Max
Unit
Oscillator pins
Vi(XTAL1)
input voltage on pin
XTAL1
0
-
1.8
V
Vo(XTAL2)
output voltage on pin
XTAL2
0
-
1.8
V
[1]
Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages.
[2]
Internal rail.
[3]
External rail.
[4]
Including voltage on outputs in 3-state mode.
[5]
VDD(3V3) supply voltages must be present.
[6]
3-state outputs go into 3-state mode when VDD(3V3) is grounded.
[7]
Accounts for 100 mV voltage drop in all supply lines.
[8]
Only allowed for a short time period.
[9]
Minimum condition for VI = 4.5 V, maximum condition for VI = 5.5 V.
[10] Applies to P1[25:16].
[11] See LPC2119/2129/2194/2292/2294 User Manual.
[12] To VSS.
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Table 7.
ADC static characteristics
VDDA = 2.5 V to 3.6 V unless otherwise specified; Tamb = 40 C to +85 C unless otherwise specified. ADC frequency
4.5 MHz.
Symbol
Parameter
Min
Typ
Max
Unit
VIA
analog input voltage
0
-
VDDA
V
Cia
analog input
capacitance
-
-
1
pF
ED
differential linearity
error
[1][2][3]
-
-
1
LSB
EL(adj)
integral non-linearity
[1][4]
-
-
2
LSB
offset error
[1][5]
-
-
3
LSB
EG
gain error
[1][6]
-
-
0.5
%
ET
absolute error
[1][7]
-
-
4
LSB
EO
[1]
Conditions
Conditions: VSSA = 0 V, VDDA = 3.3 V.
[2]
The ADC is monotonic, there are no missing codes.
[3]
The differential linearity error (ED) is the difference between the actual step width and the ideal step width. See Figure 4.
[4]
The integral non-linearity (EL(adj)) is the peak difference between the center of the steps of the actual and the ideal transfer curve after
appropriate adjustment of gain and offset errors. See Figure 4.
[5]
The offset error (EO) is the absolute difference between the straight line which fits the actual curve and the straight line which fits the
ideal curve. See Figure 4.
[6]
The gain error (EG) is the relative difference in percent between the straight line fitting the actual transfer curve after removing offset
error, and the straight line which fits the ideal transfer curve. See Figure 4.
[7]
The absolute voltage error (ET) is the maximum difference between the center of the steps of the actual transfer curve of the
non-calibrated ADC and the ideal transfer curve. See Figure 4.
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gain
error
EG
offset
error
EO
1023
1022
1021
1020
1019
1018
(2)
7
code
out
(1)
6
5
(5)
4
(4)
3
(3)
2
1 LSB
(ideal)
1
0
1
2
3
4
5
6
7
1018
1019
1020
1021
1022
1023
1024
VIA (LSBideal)
1 LSB =
offset
error
EO
VDDA − VSSA
1024
002aaa668
(1) Example of an actual transfer curve.
(2) The ideal transfer curve.
(3) Differential linearity error (ED).
(4) Integral non-linearity (EL(adj)).
(5) Center of a step of the actual transfer curve.
Fig 4. ADC characteristics
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8.1 Power consumption measurements for LPC2109/01, LPC2119/01,
LPC2129/01 devices
The power consumption measurements represent typical values for the given conditions.
The peripherals were enabled through the PCONP register, but for these measurements,
the peripherals were not configured to run. Peripherals were disabled through the PCONP
register. Refer to the LPC2119/2129/2194/2292/2294 User Manual for a description of the
PCONP register.
002aad127
45
IDD(act)
(mA)
35
all peripherals enabled
all peripherals disabled
25
15
5
12
20
28
36
44
52
60
frequency (MHz)
Test conditions: Active mode entered executing code from on-chip flash; PCLK = CCLK⁄4;
Tamb = 25 C; core voltage 1.8 V.
Fig 5.
Typical LPC2109/01 IDD(act) measured at different frequencies
002aad128
45
60 MHz
IDD(act)
(mA)
48 MHz
35
25
15
12 MHz
5
1.65
1.70
1.75
1.80
1.85
1.90
1.95
voltage (V)
Test conditions: Active mode entered executing code from on-chip flash; PCLK = CCLK⁄4;
Tamb = 25 C; core voltage 1.8 V; all peripherals enabled.
Fig 6.
Typical LPC2109/01 IDD(act) measured at different voltages
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002aad129
10
IDD(idle)
(mA)
8
all peripherals enabled
6
all peripherals disabled
4
2
0
12
20
28
36
44
52
60
frequency (MHz)
Test conditions: Idle mode entered executing code from on-chip flash; PCLK = CCLK⁄4;
Tamb = 25 C; core voltage 1.8 V.
Fig 7.
Typical LPC2109/01 IDD(idle) measured at different frequencies
002aad130
10
IDD(idle)
(mA)
60 MHz
7.5
48 MHz
5.0
2.5
12 MHz
0
1.65
1.70
1.75
1.80
1.85
1.90
1.95
voltage (V)
Test conditions: Idle mode entered executing code from on-chip flash; PCLK = CCLK⁄4;
Tamb = 25 C; core voltage 1.8 V; all peripherals enabled.
Fig 8.
Typical LPC2109/01 IDD(idle) measured at different voltages
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002aad131
45
IDD(act)
(mA)
35
all peripherals enabled
all peripherals disabled
25
15
5
12
20
28
36
44
52
60
frequency (MHz)
Test conditions: Active mode entered executing code from on-chip flash; PCLK = CCLK⁄4;
Tamb = 25 C; core voltage 1.8 V.
Fig 9.
Typical LPC2119/01 and LPC2129/01 IDD(act) measured at different frequencies
002aad132
50
IDD(act)
(mA)
60 MHz
40
48 MHz
30
20
12 MHz
10
0
1.65
1.70
1.75
1.80
1.85
1.90
1.95
voltage (V)
Test conditions: Active mode entered executing code from on-chip flash; PCLK = CCLK⁄4;
Tamb = 25 C; core voltage 1.8 V; all peripherals enabled.
Fig 10. Typical LPC2119/01 and LPC2129/01 IDD(act) measured at different voltages
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002aad133
10
IDD(idle)
(mA)
8
all peripherals enabled
all peripherals disabled
6
4
2
0
12
20
28
36
44
52
60
frequency (MHz)
Test conditions: Idle mode entered executing code from on-chip flash; PCLK = CCLK⁄4;
Tamb = 25 C; core voltage 1.8 V.
Fig 11. Typical LPC2119/01 and LPC2129/01 IDD(idle) measured at different frequencies
002aad134
10
60 MHz
IDD(idle)
(mA)
8
48 MHz
6
4
12 MHz
2
0
1.65
1.70
1.75
1.80
1.85
1.90
1.95
voltage (V)
Test conditions: Idle mode entered executing code from on-chip flash; PCLK = CCLK⁄4;
Tamb = 25 C; core voltage 1.8 V; all peripherals enabled.
Fig 12. Typical LPC2119/01 and LPC2129/01 IDD(idle) measured at different voltages
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002aad135
45
IDD(act)
(mA)
60 MHz
35
48 MHz
25
15
12 MHz
5
1.65
1.70
1.75
1.80
1.85
1.90
1.95
voltage (V)
Test conditions: Active mode entered executing code from on-chip flash; PCLK = CCLK⁄4;
Temp = 25 C; core voltage 1.8 V; all peripherals disabled.
Fig 13. Typical LPC2109/01, LPC2119/01, and LPC2129/01 IDD(act) measured at different voltages
002aad136
8
IDD(idle)
(mA)
6
60 MHz
48 MHz
4
2
12 MHz
0
1.65
1.70
1.75
1.80
1.85
1.90
1.95
voltage (V)
Test conditions: Idle mode entered executing code from on-chip flash; PCLK = CCLK⁄4;
Temp = 25 C; core voltage 1.8 V; all peripherals disabled.
Fig 14. Typical LPC2109/01, LPC2119/01, and LPC2129/01 IDD(idle) measured at different voltages
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002aad137
45
IDD(act)
(mA)
60 MHz
35
48 MHz
25
15
12 MHz
5
−40
−15
10
35
60
85
temperature (°C)
Test conditions: Active mode entered executing code from on-chip flash; PCLK = CCLK⁄4;
core voltage 1.8 V; all peripherals disabled.
Fig 15. Typical LPC2109/01, LPC2119/01, and LPC2129/01 IDD(act) measured at different temperatures
002aad138
6
60 MHz
IDD(idle)
(mA)
5
48 MHz
4
3
2
12 MHz
1
−40
−15
10
35
60
85
temperature (°C)
Test conditions: Idle mode entered executing code from on-chip flash; PCLK = CCLK⁄4;
core voltage 1.8 V; all peripherals disabled.
Fig 16. Typical LPC2109/01, LPC2119/01, and LPC2129/01 IDD(idle) measured at different temperatures
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LPC2109/2119/2129
NXP Semiconductors
Single-chip 16/32-bit microcontrollers
002aad139
200
IDD(pd)
(μA)
1.95 V
1.8 V
160
1.65 V
120
80
40
0
−40
−15
10
35
60
85
temperature (°C)
Test conditions: Power-down mode entered executing code from on-chip flash.
Fig 17. Typical LPC2109/01, LPC2119/01, and LPC2129/01 core power-down current IDD(pd) measured at different
temperatures
Table 8.
Typical LPC2109/01 peripheral power consumption in active mode
Core voltage 1.8 V; Tamb = 25 C; all measurements in A; PCLK = CCLK⁄4.
LPC2109_2119_2129
Product data sheet
Peripheral
CCLK = 12 MHz
CCLK = 48 MHz
CCLK = 60 MHz
Timer0
43
141
184
Timer1
46
150
180
UART0
98
320
398
UART1
103
351
421
PWM0
103
341
407
I2C-bus
9
37
53
SPI0/1
6
27
29
RTC
16
55
78
ADC
33
128
167
CAN1
230
764
914
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LPC2109/2119/2129
NXP Semiconductors
Single-chip 16/32-bit microcontrollers
Table 9.
Typical LPC2119/01 and LPC2129/01 peripheral power consumption in active
mode
Core voltage 1.8 V; Tamb = 25 C; all measurements in A; PCLK = CCLK⁄4.
LPC2109_2119_2129
Product data sheet
Peripheral
CCLK = 12 MHz
CCLK = 48 MHz
CCLK = 60 MHz
Timer0
43
141
184
Timer1
46
150
180
UART0
98
320
398
UART1
103
351
421
PWM0
103
341
407
I2C-bus
9
37
53
SPI0/1
6
27
29
RTC
16
55
78
ADC
33
128
167
CAN1/2
229
771
914
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LPC2109/2119/2129
NXP Semiconductors
Single-chip 16/32-bit microcontrollers
9. Dynamic characteristics
Table 10. Dynamic characteristics
Tamb = 40 C to +85 C for industrial applications; VDD(1V8), VDD(3V3) over specified ranges.[1]
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
oscillator frequency
supplied by an external
oscillator (signal generator)
1
-
50
MHz
external clock frequency
supplied by an external
crystal oscillator
1
-
30
MHz
external clock frequency if
on-chip PLL is used
10
-
25
MHz
external clock frequency if
on-chip bootloader is used
for initial code download
10
-
25
MHz
External clock
fosc
Tcy(clk)
clock cycle time
20
-
1000
ns
tCHCX
clock HIGH time
Tcy(clk)  0.4
-
-
ns
tCLCX
clock LOW time
Tcy(clk)  0.4
-
-
ns
tCLCH
clock rise time
-
-
5
ns
tCHCL
clock fall time
-
-
5
ns
Port pins (except P0[2] and P0[3])
tr
rise time
-
10
-
ns
tf
fall time
-
10
-
ns
-
ns
I2C-bus pins (P0[2] and P0[3])
fall time
tf
VIH to VIL
[2]
[1]
Parameters are valid over operating temperature range unless otherwise specified.
[2]
Bus capacitance Cb in pF, from 10 pF to 400 pF.
LPC2109_2119_2129
Product data sheet
20 + 0.1  Cb -
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LPC2109/2119/2129
NXP Semiconductors
Single-chip 16/32-bit microcontrollers
9.1 Timing
tCHCL
tCHCX
tCLCH
tCLCX
Tcy(clk)
002aaa907
Fig 18. External clock timing (with an amplitude of at least Vi(RMS) = 200 mV)
LPC2109_2119_2129
Product data sheet
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LPC2109/2119/2129
NXP Semiconductors
Single-chip 16/32-bit microcontrollers
10. Package outline
LQFP64: plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm
SOT314-2
c
y
X
A
48
33
49
32
ZE
e
E HE
A
A2
(A 3)
A1
wM
θ
bp
pin 1 index
64
Lp
L
17
detail X
16
1
ZD
e
v M A
wM
bp
D
B
HD
v M B
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
mm
1.6
0.20
0.05
1.45
1.35
0.25
0.27
0.17
0.18
0.12
10.1
9.9
10.1
9.9
0.5
HD
HE
12.15 12.15
11.85 11.85
L
Lp
v
w
y
1
0.75
0.45
0.2
0.12
0.1
Z D (1) Z E (1)
1.45
1.05
1.45
1.05
θ
7o
o
0
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT314-2
136E10
MS-026
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
00-01-19
03-02-25
Fig 19. Package outline SOT314-2 (LQFP64)
LPC2109_2119_2129
Product data sheet
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Single-chip 16/32-bit microcontrollers
11. Abbreviations
Table 11.
LPC2109_2119_2129
Product data sheet
Abbreviations
Acronym
Description
ADC
Analog-to-Digital Converter
AMBA
Advanced Microcontroller Bus Architecture
APB
Advanced Peripheral Bus
CAN
Controller Area Network
CPU
Central Processing Unit
DCC
Debug Communications Channel
FIFO
First In, First Out
GPIO
General Purpose Input/Output
I/O
Input/Output
PLL
Phase-Locked Loop
PWM
Pulse Width Modulator
RAM
Random Access Memory
SPI
Serial Peripheral Interface
SRAM
Static Random Access Memory
SSI
Synchronous Serial Interface
SSP
Synchronous Serial Port
TTL
Transistor-Transistor Logic
UART
Universal Asynchronous Receiver/Transmitter
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NXP Semiconductors
Single-chip 16/32-bit microcontrollers
12. Revision history
Table 12.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
LPC2109_2119_2129 v.7
20110614
Product data sheet
201004021F
LPC2109_2119_2129 v.6
Modifications:
LPC2109_2119_2129 v.6
Modifications:
•
Table 6 “Static characteristics”; Changed /01 Power-down mode supply current (IDD(pd))
from 180 A to 500 A for industrial temperature range.
•
•
Table 6 “Static characteristics”; Moved Vhys voltage from typical to minimum.
Table 6 “Static characteristics”; Changed I2C pad hysteresis from 0.5VDD(3V3) to
0.05VDD(3V3).
20071210
Product data sheet
-
LPC2109_2119_2129 v.5
•
•
•
•
Type number LPC2109FBD64/01 has been added.
•
•
Power measurements for LPC2109/2119/2129/01 devices have been added.
Type number LPC2119FBD64/01 has been added.
Type number LPC2129FBD64/01 has been added.
Details introduced with /01 devices on new peripherals/features (Fast I/O Ports, SSP, CRP)
and enhancements to existing ones (UART0/1, Timers, ADC, and SPI) have been added.
Description of JTAG pin TCK has been updated.
LPC2109_2119_2129 v.5
20070627
Product data sheet
-
LPC2119_2129 v.4
LPC2119_2129 v.4
20060714
Product data sheet
-
LPC2119_2129 v.3
LPC2119_2129 v.3
20041222
Product data
-
LPC2119_2129 v.2
LPC2119_2129 v.2
20040202
Preliminary data
-
LPC2119_2129 v.1
LPC2119_2129 v.1
20031118
Preliminary data
-
-
LPC2109_2119_2129
Product data sheet
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13. Legal information
13.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
13.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
LPC2109_2119_2129
Product data sheet
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LPC2109/2119/2129
NXP Semiconductors
Single-chip 16/32-bit microcontrollers
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
I2C-bus — logo is a trademark of NXP B.V.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
LPC2109_2119_2129
Product data sheet
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LPC2109/2119/2129
Single-chip 16/32-bit microcontrollers
15. Contents
1
2
2.1
2.2
3
3.1
4
5
5.1
5.2
6
6.1
6.2
6.3
6.4
6.5
6.5.1
6.6
6.7
6.7.1
6.7.2
6.8
6.8.1
6.8.2
6.9
6.9.1
6.10
6.10.1
6.10.2
6.11
6.11.1
6.12
6.12.1
6.12.2
6.13
6.13.1
6.14
6.14.1
6.14.2
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Key features brought by
LPC2109/2119/2129/01 devices. . . . . . . . . . . . 1
Key features common for all devices . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 3
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pinning information . . . . . . . . . . . . . . . . . . . . . . 5
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 6
Functional description . . . . . . . . . . . . . . . . . . 10
Architectural overview . . . . . . . . . . . . . . . . . . 10
On-chip flash program memory . . . . . . . . . . . 10
On-chip SRAM . . . . . . . . . . . . . . . . . . . . . . . . 11
Memory map. . . . . . . . . . . . . . . . . . . . . . . . . . 11
Interrupt controller . . . . . . . . . . . . . . . . . . . . . 12
Interrupt sources. . . . . . . . . . . . . . . . . . . . . . . 13
Pin connect block . . . . . . . . . . . . . . . . . . . . . . 14
General purpose parallel I/O (GPIO) and
Fast I/O . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Features added with the Fast GPIO set of
registers available on
LPC2109/2119/2129/01 only . . . . . . . . . . . . . 14
10-bit ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
ADC features available in
LPC2109/2119/2129/01 only . . . . . . . . . . . . . 15
CAN controllers and acceptance filter . . . . . . 15
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
UARTs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
UART features available in
LPC2109/2119/2129/01 only . . . . . . . . . . . . . 16
I2C-bus serial I/O controller . . . . . . . . . . . . . . 16
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
SPI serial I/O controller. . . . . . . . . . . . . . . . . . 17
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Features available in LPC2109/2119/2129/01
only . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
SSP controller (LPC2109/2119/2129/01 only) 17
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
General purpose timers . . . . . . . . . . . . . . . . . 17
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Features available in LPC2109/2119/2129/01
only . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
6.15
Watchdog timer . . . . . . . . . . . . . . . . . . . . . . .
6.15.1
Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6.16
Real-time clock . . . . . . . . . . . . . . . . . . . . . . .
6.16.1
Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6.17
Pulse width modulator . . . . . . . . . . . . . . . . . .
6.17.1
Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6.18
System control . . . . . . . . . . . . . . . . . . . . . . . .
6.18.1
Crystal oscillator. . . . . . . . . . . . . . . . . . . . . . .
6.18.2
PLL. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6.18.3
Reset and wake-up timer . . . . . . . . . . . . . . . .
6.18.4
Code security (Code Read Protection - CRP)
6.18.5
External interrupt inputs . . . . . . . . . . . . . . . . .
6.18.6
Memory mapping control . . . . . . . . . . . . . . . .
6.18.7
Power control . . . . . . . . . . . . . . . . . . . . . . . . .
6.18.8
APB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6.19
Emulation and debugging . . . . . . . . . . . . . . .
6.19.1
EmbeddedICE . . . . . . . . . . . . . . . . . . . . . . . .
6.19.2
Embedded trace macrocell . . . . . . . . . . . . . .
6.19.3
RealMonitor . . . . . . . . . . . . . . . . . . . . . . . . . .
7
Limiting values . . . . . . . . . . . . . . . . . . . . . . . .
8
Static characteristics . . . . . . . . . . . . . . . . . . .
8.1
Power consumption measurements for
LPC2109/01, LPC2119/01, LPC2129/01
devices. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
9
Dynamic characteristics. . . . . . . . . . . . . . . . .
9.1
Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
10
Package outline. . . . . . . . . . . . . . . . . . . . . . . .
11
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . .
12
Revision history . . . . . . . . . . . . . . . . . . . . . . .
13
Legal information . . . . . . . . . . . . . . . . . . . . . .
13.1
Data sheet status . . . . . . . . . . . . . . . . . . . . . .
13.2
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . .
13.3
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . .
13.4
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . .
14
Contact information . . . . . . . . . . . . . . . . . . . .
15
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
18
18
19
19
19
20
20
20
21
21
21
22
22
22
23
23
23
23
24
25
26
31
39
40
41
42
43
44
44
44
44
45
45
46
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 14 June 2011
Document identifier: LPC2109_2119_2129